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Detailed explanation of LED chip structure and application prospects
Nowadays, LED lights can be seen everywhere in our lives. To achieve better performance, LEDs need a powerful chip. The main function of the LED chip is to convert electrical energy into light energy. The main material of the chip is monocrystalline silicon.
The semiconductor wafer consists of two parts, one part is a P-type semiconductor, in which the hole dominates, and the other end is an N-type semiconductor, which is mainly electrons here. But when the two semiconductors are connected, they form a PN junction. When a current is applied to the wafer through the wire, the electrons are pushed toward the P region where the electrons recombine with the holes and then emit energy in the form of photons.
LED chip structure
LED chips have two basic structures, horizontal and vertical. The so-called lateral structure LED chip means that the two electrodes of the chip are on the same side of the epitaxial wafer. Since the electrodes are on the same side, the lateral flow of current in the n- and p-type confinement layers is not conducive to the diffusion of current and the dissipation of heat. In contrast, a vertical structure LED chip means that two electrodes are distributed on the opposite side of the epitaxial wafer, with the patterned electrode and the entire p-type confinement layer as the second electrode, so that the current flows almost entirely vertically through the LED epitaxial layer, with little lateral flow. Current.
Currently, vertical structure LEDs can be classified into GaP-based LEDs, GaN-based LEDs, and ZnO-based LEDs by material. The LEDs are respectively indicated by red and black, and are respectively electrically connected to the heat sink or the positive and negative electrodes on the PCB or the circuit board. The external power supply is connected to the "ten" and "one" poles on the board.
The selection of substrate materials is a primary consideration for the fabrication of LED chips. Which suitable substrate should be used depends on the requirements of the device and the LED device. The three substrate materials are sapphire, silicon, silicon carbide.
LED chips are generally small in size. Small-power chips are generally divided into 8mil, 9mil, 12mil, 14mil, etc., which are as thin as hair. It used to be very hard to count manually, and the accuracy is extremely low. LED chips use the commonly encountered problems, such as other packaging processes can also form a forward pressure drop, the primary cause is insufficient curing of silver glue, bracket or chip electrode contamination, etc., forming a large touch resistance or unstable touch resistance.
The prospect of LED chips
The LED was originally used as an indicator light source for instrumentation. Later, various light-colored LEDs were widely used in traffic lights and large-area displays, resulting in good economic and social benefits. With the rapid development of LED technology and the gradual improvement of LED light efficiency, the application of LED will become more and more extensive. With the increasing global energy shortage, people are paying more and more attention to the development prospects of LED in the lighting market. LED will be the potential light source to replace incandescent lamps, tungsten lamps and fluorescent lamps. The LED lighting market has broad development space.